Organization Description:
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted unaudited revenue of $4.36 billion in 2012.
NXP has one of the strongest portfolios of high performance mixed signal solutions in the industry, ranging from high performing ICs in RF to Power & Lighting Solutions and applications for new markets (e.g., personal health, mobile audio). Combined with best-in-class design-in support, NXP enables innovative solutions, fully answering customers’ needs. The next generation of applications in the area of Industrial & Infrastructure will strongly benefit from the enhanced processing capabilities and technology NXP has to offer. NXP’s technology expertise enables delivery of innovative, easy to implement solutions that meet even the most demanding customers’ requirements. Additional information can be found by visiting www.nxp.com.
The Business Line RF Power develops RF power transistors, modules and MMICs for Cellular Infrastructure (Base Stations), Broadcast, ISM and Aerospace & Defense markets, using in-house LDMOS technology and foundry. The Business Line has grown to very strong #2 position in the market worldwide. Next to the headquarters in Nijmegen there are also teams located in France, US and China.
Your Responsibilities:
The Package Development Engineer will be at the leading edge of initiating and implementing breakthrough developments in advanced semiconductor device packages. You will work in a multi-disciplinary and multi cultural environment, working in project teams to create highly advanced and cost-effective device package solutions that meet the ever-increasing performance, reliability and cost requirements. The Package Development Engineer has a broad range of skills in the following areas:
- Package Innovation
- Quality and reliability
- Volume Manufacturing
- Building and maintaining contacts with key suppliers
Key Areas of Responsibility:
• Support our RF Engineers with all relevant package and assembly aspects to enable optimal product development
• Development and production release of new RF Power packages, covering both technical as well as Project Management aspect.
• Establish, implement and release new assembly processes in close cooperation with our Far-east manufacturing sites.
• Own and maintain assembly design rules for our High Performance RF packaging portfolio (both plastic and ceramics)
• Generate and validate new assembly design rules for new or changed package platforms, including:
- generation of test vehicle concepts to be used for this validation
- Equipment MSA, tolerance analysis and DOE planning and execution
- documentation
• Participate in Industrial & Quality improvement teams.
• Providing inputs to the Package and Assembly Roadmap and support the execution of technical programs /projects on this roadmap
• Benchmark new technologies, materials, processes and platforms in alignment with the product and technology roadmap
• Advising/solving qualification- or field return problems in close co-operation with QA/Test and product engineering and the factories/subcontractors.
• Work in (international) project teams
Your Profile
• Hands-on approach; self propelling; team player.
• Proven attitude for innovative thinking, enabling the creation of technological breakthroughs.
• Capability to apply knowledge effectively in a business environment.
• Knowledge on High Volume Manufacturing
• A technical qualification on Master degree level(e.g. Material Science, Mechanical Engineering, Organic Chemistry)
• A minimum of 5-10 years relevant experience in packaging and assembly of microelectronic devices.
• Excellent communication skills, both verbal and written in English
• Knowledge in using CAD/Design tools with respect to package development
• Knowledge of high frequency / high power packaging is a pré
• Willingness to travel (15%).
