Magdeburg Site Yield Department Manager

Intel has announced a major expansion of Intel's production capacities in Europe and plans to develop two first-of-their-kind semiconductor fabs in Magdeburg, Germany, the capital of Saxony-Anhalt. Planning has started, with construction expected to begin in the first half of 2023 and production planned to come online in 2027, subject to European Commission State aid approval and funding approval by the German authorities.



This position is the Yield and Integration Department Manager of the Magdeburg, Germany greenfield mega-site: a large-scale, multi fab, 3000+ employee operation supporting Intel's internal and foundry wafer supply with production expected to start in 2027 This position reports to the Intel Vice President of Operations for the Magdeburg Site.

The Site Yield and Integration Department Manager will be reporting to the Fab Operations Vice President and will be responsible for but not limited to owning fabs yield strategy and best-in-class performance.

The role implies leading a team of technical managers and senior technologists, as well as partnering with the Intel factory network and the technology development team. This role also entails intensive planning & design efforts in various areas of this function, for this project and other related projects.

Final location is Magdeburg site. Interim location of this role is Home Based Office until office premises will be available, ETA: Q4 2022.

Key responsibilities:

• Working with Yield Analysis tools (techniques and systems), Process Engineering knowledge, Process Control, device knowledge, materials analysis techniques and Fault Analysis Layout sensitivities to identify Product Yield issues and drive EOL Yields to Best in Class

• Process Integration of FINFET, Strained SiGe , Hi K dielectric+Metal Gate, immersion Lithography plus spacer-based double and quad patterning, driving continuous improvement projects to achieve Best in Class yielding, reliable products

• Developing continuous improvement projects at module level to improve process to give reliable, High yielding, cost-effective products

• Influencing multifunctional fab groups, driving actions to reduce defect density and higher yields

• Driving yield roadmaps with multi-discipline teams with (Process Engineers, Integration Engineers and Yield Analysts) to deliver reliable, cost-effective and stable/capable products

• Driving yield analysis techniques and systems

• Working on process transfers to High Volume Manufacturing Factories, solving complex integrated issues delivering matched yields and product performance.

• Applying in-depth process flow integration knowledge including the understanding of defect formation/evolution, process integrated defect and yield impacts

• Applying knowledge of Layout sensitive defects, Design for Testability and knowledge of raster, scan diagnosis and other LYA data systems.

• Applying knowledge of processing techniques (Lithography, Etch, Implant, CMP, CVD, plating, diffusion, thin films, etc.), yield engineering data analysis tools, and working knowledge of semiconductor devices.

• Applying knowledge of module tool impacts to defects, inline parametrics and yield through PM life while understanding upstream and downstream impacts to other tools.

Demonstrated results and accountability for leadership and role modelling of Intel's cultural attributes as follows:

• Customer obsessed - seek to understand what matters most to our customers, listening more and talking less.

• One Intel - We before Me. We work across boundaries, collaborating across the aisle and around the world.

• Fearless - We are bold. We take risks and challenge ourselves. We fail fast, iterate, and continuously improve.

• Truth and Transparency - allows the best ideas to emerge and speeds our ability to solve problems faster.

• Inclusion - Inclusion runs through each attribute and is integral to our culture evolution.

The ideal candidate should exhibit the following behavioral traits:

• Safety role modelling

• Capable of inspiring, leading and motivating a large diverse workforce with a high sense of urgency.

• Inspire engagement, collaboration, teamwork and commitment within the organization, the global factory network, and partner organizations.

• Apply broad and deep business and strategic acumen

• Exceptional people manager (people skills) and organizational leadership, achieving results though people, inclusive and leveraging diversity

• Set clear, actionable strategies to meet the business needs

• Role model courage, candor, and integrity in the face of change

• Take informed risks and promote an environment that challenges the status quo

Qualifications

Minimum Qualifications and requirements:

• Candidates must possess a BSc, MSc or PhD in Engineering or Science (e.g. physics, chemistry, electrical engineering, chemical engineering, material science, industrial engineering and another engineering/science-related field)

• Substantial Yield Engineering, Manufacturing experience or in other related engineering functional areas in 300mm semiconductor manufacturing with a similar scope and function

• Significant experience in 300mm fabs startup/ramping advanced logic process technologies; as well as planning/execution of yield enhancement roadmaps

• Must-have yield data analytics skills (data query, cleaning/sanity check, preparation, data analysis/statistical method (via JMP), visualization, drawing conclusion), gained in wafer fab environment

• Demonstrated Leadership and Management of senior technical teams

• Excellent interpersonal and communication skills

• Strong stakeholder management skills

• Fluency in the German language is essential

• Candidate must be willing to relocate to Magdeburg